01
Cu Paste
Multimodal Cu particle design for dense packing, conductivity and controlled sintering behavior.
High-AR TGV Cu Metallization
Metalizing the
glass era.
Cu paste filling technology engineered for high aspect ratio TGV — integrating material, filling, densification and sintering into one process platform.
NEXT-GENERATION
GLASS CORE PACKAGING
GLASS CORE PACKAGING
SCROLL
01
Why now
As packages get larger and denser,
metallization gets harder.
High-AR TGV pushes conventional plating toward more difficult seed formation, longer filling time, higher void risk and growing equipment burden. TERAMICX is built around a different approach: filling the via volume directly with engineered Cu paste.
02
Technology platform
Four disciplines.
One process window.
02
Paste Filling
Vacuum and differential pressure to suppress trapped air and fill deep vias uniformly.
03
Densification
Post-filling particle rearrangement to improve green density and minimize void and shrinkage.
04
Sintering
Low-temperature thermal profiles optimized for Cu necking, conductivity and glass interface stability.
Integrated full stack
Not just a paste.
A process architecture.
TERAMICX links formulation, filling conditions, densification and sintering as a single engineering system — designed to move from lab validation to customer-specific qualification.
FormulationVacuum + PressureVoid ControlLow-Temp Sintering
03
Validated performance
Measured.
Not imagined.
2.07 μΩ·cm
Measured resistivity
Best measured value from Cu paste sintered sample.
100 cycles
TCT, no crack
Verified at -55°C to +125°C and -55°C to +150°C conditions.
11:1 AR
Internal structure verified
SEM validation demonstrated dense filling and stable Glass–Cu interface.
70%+ potential
CAPEX reduction
Internal scenario versus seed / plating line at scaled production capacity.
Current development direction
Moving from validated process performance toward repeatability, extended reliability and customer qualification.
Strategic position
Designed for the zone where plating becomes increasingly difficult.
As via depth and aspect ratio rise, process burden can grow non-linearly across time, yield and equipment. TERAMICX targets the high-AR region where direct volumetric filling can become structurally attractive.
AR 5
AR 8
AR 12
AR 15+
TERAMICX STRATEGIC ZONE →
04
Application focus
Where glass enables
the next package.
AI / HPC Glass Core
Large, dense package architectures with demanding dimensional stability.
Large FC-BGA
Advanced core structures requiring scalable vertical interconnect metallization.
Chiplet Integration
Interconnect-intensive packaging platforms built around precision and density.
CPO / Optical Packaging
Emerging high-density packaging environments requiring compact electrical interconnects.
Connect
Let’s build the
glass interconnect layer.
For technical evaluation, joint development, qualification or pilot discussions, contact TERAMICX.
admin@teramicx.com ↗TERAMICX
136, Jiksan-ro, Jiksan-eup,Seobuk-gu, Cheonan-si,
Chungcheongnam-do,
Republic of Korea
(ZIP: 31035) admin@teramicx.com